NEW T3/E3 MULTIPLEXER FROM DALLAS SEMICONDUCTOR SIMPLIFIES T3/E3 CONNECTIVITY
DALLAS, TX-December 11, 2000-Dallas Semiconductor announced today the DS3112 TEMPE, a new T3/E3 multiplexer with the flexibility to adapt to various Wide Area Network (WAN) configurations and interfaces. As a single chip with five different operating modes, TEMPE can be configured for several different T3 and E3 applications. This flexibility saves development effort and customization costs, enabling one hardware design to meet a variety of customer needs and support worldwide deployment.
 T1 and E1 transmission lines are used throughout the world to transport phone calls and data at the edge of the network. Where higher data rates are needed, T3 and E3 lines are often deployed. A T3 line (44.736 Mbps) aggregates 28 T1 lines (1.544 Mbps) or 21 E1 lines (2.048 Mbps). An E3 line (34.368 Mbps) aggregates 16 E1 lines. The various line aggregations are accomplished with three multiplex configurations, termed M13, G.747, and E13, respectively.
A multiplexer such as the DS3112 TEMPE is used to merge lower-speed T1/E1 traffic to and from a high-density T3 or E3 trunk. Applications include WAN access equipment, PBXs, access concentrators, digital cross-connect systems, switches, routers, optical multiplexers, ADMs, and test equipment. Previously, the variety and complexity of these applications required multiple interface designs.
Drew Jenkins, Communications product manager, said, "The DS3112 TEMPE is a single chip with five different modes of operation. It can perform all three types of multiplexing for channelized voice and data applications-M13, E13 and G.747. It can also be configured as a standalone T3 or E3 framer for unchannelized data, such as Frame Relay or ATM over T3. With TEMPE, a single T3 or E3 line card design gains the flexibility to be deployed in a variety of configurations."
Technical Features
TEMPE supports M23 and C-bit parity framing for DS3 as well as G.751 framing for E3. User-programmable features include an HDLC controller for the Path Maintenance Data Link, an advanced FEAC controller, a Bit Error Rate Tester, and a full suite of error detection and diagnostic tools. To support system maintenance, TEMPE can redirect any of the T1/E1 streams to either of two add-drop ports for monitoring. The device also features T1/E1 and T3/E3 loopback code detection and loopback paths. All clock, data and sync signals can be inverted for glueless interface to neighboring components. Device-driver software available from Dallas Semiconductor supports all TEMPE features and minimizes design time.
Other T3/E3 products are on the way. Said Jenkins, "In the coming months Dallas Semiconductor plans to introduce a T3/E3 Line Interface Unit (LIU) and a 28-channel T1 Framer that will interface seamlessly to TEMPE. These products will become the building blocks for T3 and E3 trunks that can carry everything from one 44 Mbit/s data pipe to 672 phone calls."
Price and Availability
The DS3112 TEMPE is packaged in a 27mm, 256-lead BGA. Samples are available now. Production quantities will be available within 60 days at a cost of $82.29 each (1000-piece quantity) for industrial temperature range.
Dallas Semiconductor manufactures specialty semiconductors focused in three areas: Communications, 1-Wire® and Network Computing, and Mixed Signal. The Company combines proprietary fab and circuit technologies to create innovative products that are sold to over 15,000 customers worldwide. Applications include broadband telecommunications, wireless handsets, cellular base stations, secure Internet communications, networking, servers, data storage and a wide variety of industrial equipment.
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