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Maxim >
제품 >
고주파 ASIC
RF 및 무선
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레이저 트림
Wireless Products Maxim can laser trim to adjust circuit performance after wafer fabrication. This adds flexibility in the design of your ICs. Maxim has been using this process for 20 years and has extensive reliability and performance data.
Trimming can be done for absolute accuracy ("passive" trim) or for dynamic performance ("active" trim).
Maxim can provide you with a quotation for NRE and production costs associated with laser trim.
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